Due to the continual miniaturization of electronics PCB need, appeared a chip component, the traditional welding methods can not meet needs. First adopted in the hybrid integrated circuit board assembly reflow soldering process, assembly welding components mostly chip capacitor, chip inductor, SMT transistor and diode, etc. With the development of SMT the whole technology improvement, a variety of SMT components (SMC) and the emergence of mount devices (SMD), as a part of the SMT technology reflow soldering process technology and equipment have been expanded to a corresponding its applications are becoming more and more widely, in almost all electronic products have been applied, and reflow soldering technology, around the improvement of equipment has also experienced the following stages of development.
Edit this section of the hot plate conduction reflow soldering
This kind of reflow furnace on the conveyor belt or push board
RichScan
