In SMT production process, the stand or fall of reflow soldering setting is the key factor affecting the quality of welding, through temperature curve, can for the reflow soldering, reflow soldering parameters Settings provide the theory basis of accurately, in most cases, the temperature distribution by the characteristics of the circuit board assembly, solder paste properties and the effect of reflow furnace capacity used.
Through the section description of reflow soldering temperature curve, understand each solder paste composition of the change at different stages in the reflow oven, give some basic data for optimal temperature curve, and analyze the adverse temperature curve may cause reflow soldering defects.
A, cooling section
This is a piece of lead in solder paste tin powder has been melted, and fully welding surface wetting, fast cooling will be the bright spot and ?
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