Infrared technology has become mainstream, because it has many advantages. Such as cost is not high, has high stability, high heat capacity and heat efficiency. These are important in the reflow process. But due to the infrared belongs to radiation technology, it will be weaknesses in the supplementary radiation technology, there are risks of overtemperature and unable to deal with differences in thermal properties between solder joints temperature difference problem. This technology, if equipment (furnace) on the heating efficiency of design, even will increase the temperature difference between the solder joint. This is a very unpopular weakness. Combined with different devices and materials on the radiation wave exist different absorptive capacity, and high density structure of the layout or the device itself may cause such problems as "shadow effect", cause it
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