The main factors influencing the solder paste printing quality
time：2015-04-17 views:548
Main factors affecting the quality of solder paste printing:
Quality: 1. The first is the stencil stencil thickness and opening size determines the amount of solder paste printing. Too much solder paste volume will produce bridge, too little amount of solder paste produces insufficient solder paste or virtual welding. Stencil opening shape and whether smooth hole wall will affect the quality of mold release.
2. The second is the quality of solder paste, solder paste viscosity, printing (rolling, metastatic), and the service life of room temperature will affect the printing quality.
3. Printing process parameters: the scraper speed, pressure, scraper and screen Angle, and the constraint relationship between the viscosity of the solder paste must be, so only control these parameters correctly, to ensure the quality of solder paste printing.
4. The precision equipment: high density fine pitch products in printing, printing printing ?
