In recent years, along with many electronic products to develop in the direction of small, lightweight, high density, especially the use of handheld devices, in terms of components material processes are put forward the serious challenge, the primary SMT technology and therefore make the SM got rapid development opportunities. LC pin pin pitch development, 0.4 mm and 0.3 mm to 0.5 mm, BGA has been widely adopted, CSP also emerged, and present a trend of rapid rise, no clean, low residual solder paste on material widely used. All of this puts forward new requirements to the reflow soldering process, a general trend is the requirement reflow soldering using more advanced way of heat transfer, achieve energy saving, uniform temperature, suitable for double panel PCB welding requirements and new components encapsulation way, and gradually realize the comprehensive instead of wave soldering. Overall ?
